Capabilities

Resources organised around your manufacturing package.

Our SMT line announces a placement rate of 30,000 components per hour and combines printing, solder paste inspection, placement, reflow and optical inspection.

Assembly

SMT, through-hole and mixed boards, wiring, harnesses, programming and rework as required.

Inspection and test

SPI, 3D AOI, functional tests and control plans defined for the product and its acceptance criteria.

Protection and integration

Coating, encapsulation, electromechanical integration, final assembly, identification and packaging.

Let’s discuss your next electronics project

Describe your need and share the available information. Our team will review the package and define a suitable proposal.

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